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suggested improvements to the 1.3.3. manual

PostPosted: Mon Jul 22, 2013 5:35 am
by summetj
Suggested improvements to the 1.3.3 manual:

Page 25, step 12. "Place the heads of the screws/bolts on the bottom of the circuit board, and the nuts on the top so that they won't hit the bottom of the case." (This is shown in the pictures if you are paying attention, I wasn't...)

Page 29 step 3. You mention the sil-pad for the first time here. I'd recommend highlighting them a bit more, mentioning them by name at the top of the section where you can explain that they are used to prevent electrical contact, and telling us if we should be thermal compound on both sides or only one. (I did both...)


Also: Hot Glue is a safe recommendation, but you might want to have a sidenote telling people that they can use acrylic welding solvent (I used IPS Weld On #3) for a nicer appearance for all acrylic-2-acrylic joints.

And one kit weirdness: The pre-coiled wire for my GDT had 4 wires, not 3. I just left one set unconnected.
(I didn't notice the extra wire until after I had wrapped the toroid.)

Jay

Re: suggested improvements to the 1.3.3. manual

PostPosted: Thu Jul 25, 2013 7:38 am
by Heidi
The extra wire is intended to be grounding wire. Sorry that was confusing.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Sat Jul 27, 2013 4:51 pm
by Slartibartfast
Heidi wrote:The extra wire is intended to be grounding wire. Sorry that was confusing.

My kit also has a pre-twisted GDT wire bundle with four wires.
Should we connect the extra grounding wire someplace? Or is it best to remove it, or just leave it unconnected?

Re: suggested improvements to the 1.3.3. manual

PostPosted: Mon Jul 29, 2013 5:34 pm
by Bayley
You should untwist that fourth wire and use it to ground the secondary.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Wed Jul 31, 2013 7:14 pm
by tekart
Heidi wrote:The extra wire is intended to be grounding wire. Sorry that was confusing.


Can you be more explicit? Ground both ends, or just one end? Solder to what the power entry? Seems kinda weird.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Thu Aug 01, 2013 4:22 am
by Ross
I removed the 4th wire, then did the drill trick to add some extra twists; I figured not doing so would incress the losses by inducing a EMF in the non-used wire.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Thu Aug 01, 2013 4:23 am
by Ross
Make mention of the jummper, what is its purpose, when do we use it and what state should it be in, open/closed. It might be in the manual some place, but I couldent find it.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Fri Aug 02, 2013 3:19 am
by Ross
In the pictures of the manual you have grounded the heatsink, i find no mention of doing this in the instruction, should we be doing this?

Re: suggested improvements to the 1.3.3. manual

PostPosted: Fri Aug 02, 2013 12:18 pm
by Bayley
Ross wrote:In the pictures of the manual you have grounded the heatsink, i find no mention of doing this in the instruction, should we be doing this?


Nope.

Re: suggested improvements to the 1.3.3. manual

PostPosted: Tue Sep 10, 2013 9:34 pm
by jagaparan
Step 16 of the 1.3.3 Manual does not mention powering up the logic driver board with the 19v power supply.
I am guessing it should be powered up before plugging in the IEC cable.